Package Type:QFN128 14*14; Type C / DP to 4-port LVDS, support 3D splitter, HDCP 1.3, with integrated MCU
Package Type:BGA144 7×7; Type C / DP to 4-port MIPI DSI/CSI, support 3D splitter, HDCP 1.3, with integrated MCU, BGA package
Package Type:QFN64 7.5×7.5; type C/DP to 2-port LVDS, support HDCP 1.3, with integrated MCU , 3D splitter
Package Type:QFN128 14*14; Type C / DP to 4-port MIPI DSI/CSI, support 3D splitter, HDCP 1.3, with integrated MCU
Package Type:BGA144 7×7; Type C / DP to 4-port MIPI DSI/CSI, support 3D splitter, HDCP 1.3, with integrated MCU, BGA package
Package Type:QFN64 7.5×7.5; Type C/DP to 2-port MIPI DSI/CSI, support HDCP 1.3, with integrated MCU, 3D slitter
Type-C/DP 1.4 to 4-Port MIPI/LVDS with Audio Compliant with DisplayPort 1.4a (DP 1.4a) & Embedded DisplayPort 1.4b (eDP 1.4b) Type-C DisplayPort Alt Mode Maximum resolution
Package Type:QFN64 7.5×7.5 EPAD; True USB2.0 Repeater on CAT5/6 single differential pair
available from 09:00 – 18:00
Email: info@vimos-technologies.com
Address: Mehlbeerenstr. 4, 82024 Taufkirchen, Germany
The bi-monthly ViMOS Technologies Newsletter provides information about latest product innovations, about interesting applications and solutions, evaluation and development kits, and about events and product trainings.
The bi-monthly ViMOS Technologies Newsletter provides information about latest product innovations, about interesting applications and solutions, evaluation and development kits, and about events and product trainings.
